Pasta termica Thermaltake TG-30 4G
Producător:
THERMALTAKE
Preț
3834Lei
-
0.053 Kg
- Destinate pentru:Охлаждащи системи
- X-ka 2:TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
- X-ka 3:The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
- X-ka 4:Density: 2.55 g/cm3
- X-ka 5:Viscosity: 76 Pa-s
- X-ka 6:Thermal impedance: 0.185°C -in2/W
- X-ka 7:Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
- X-ka 8:The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.
